Important Points
- Provides mechanical support
- Electrically connects electronic components using conductive pathways
- Also referred as PWB-Printed wiring Board
- PCB populated with components is called PCA or PCBA-Printed Circuit Board Assembly
Materials
- Conductive path - copper foil
- Insulated layer - epoxy resin prepreg
- Dielectric - Teflon, FR4, FR5, FR6, CEM1, CEM3, CEM4, CEM5, G10 etc.
Trace
:- The conductive Cu path is called TRACE.
Etching:- Removing undesired Cu leaving only desired Cu traces is called
Etching process.
Production
- Silk screen printing
- Photoengraving
- PCB Milling
- Addictive process
Drilling
Drill bit - made of solid tungsten carbide.
Holes are filled with angular rings.
PTH - Plated Through Hole
Via :- The electrically conductive plated holes in the PCB is called via.
Types of via
- Standard via
- Bind via :- from one side of the board to one or two of the inner layer, but it do not protrude through the other side
- Buried via :- connects one or more inner layers
- Silkscreen layer :- component overlay/ component layer ( top/ bottom )
- A multilayer PCB is made up of individual boards separated by pre-impregnated bonding of layers, also known as "prepreg"
Electrical testing :-
- Flying probe test machine
- Bed of nails test machine
Board thickness :-
1.6 mm standard ( 0.8, 2.4 mm are also available )
Surface finish :-
SMOBC-Solder Mask Over Bare Copper, HAL-Hot Air Leveling, Goldflash
Notes :-
1.6 mm standard ( 0.8, 2.4 mm are also available )
Surface finish :-
SMOBC-Solder Mask Over Bare Copper, HAL-Hot Air Leveling, Goldflash
Notes :-
- 100 thou - 2.54 mm; 100 thou basic measuring point
- via:- 0.5 - 0.7 mm
- R, C, D round pad and IC oval pad
- High frequency traces are short
- Minimum 8 mm gap between 230 and isolated signal traces
- Pad size should be at least 1.8 times the size of hole